Threats and Vulnerabilities to IoT End Devices Architecture and suggested remedies
Prateek Mishra1, Sanjay Kumar Yadav2
1Prateek Mishra, Department of Computer Science and Information Technology, Sam Higginbottom University of Agriculture, Technology and Science (SHUATS), Allahabad, UP. India.
2Sanjay Kumar Yadav, Department of Computer Science and Information Technology, Sam Higginbottom University of Agriculture, Technology and Science (SHUATS), Allahabad, UP. India.
Manuscript received on February 28, 2020. | Revised Manuscript received on March 22, 2020. | Manuscript published on March 30, 2020. | PP: 5712-5718 | Volume-8 Issue-6, March 2020. | Retrieval Number: F9469038620 /2020©BEIESP | DOI: 10.35940/ijrte.F9469.038620
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: Due to decentralization of Internet of Things(IoT) applications and anything, anytime, anywhere connectivity has increased burden of data processing and decision making at IoT end devices. This overhead initiated new bugs and vulnerabilities thus security threats are emerging and presenting new challenges on these end devices. IoT End Devices rely on Trusted Execution Environments (TEEs) by implementing Root of trust (RoT) as soon as power is on thus forming Chain of trust (CoT) to ensure authenticity, integrity and confidentiality of every bit and byte of Trusted Computing Base (TCB) but due to un-trusted external world connectivity and security flaws such as Spectre and meltdown vulnerabilities present in the TCB of TEE has made CoT unstable and whole TEE are being misutilized. This paper suggests remedial solutions for the threats arising due to bugs and vulnerabilities present in the different components of TCB so as to ensure the stable CoT resulting into robust TEE.
Keywords: Internet of Things, IoT End Devices, RoT, Bugs, Vulnerabilities, TCB, CoT, TEE.
Scope of the Article: Computer Architecture and VLSI.