Forced Convection upon Heat Sink of AL-Cu for Design Optimization by Experimental and CFD Analysis for cooling of ICs in CPU
Srinivas. D1, S. Ramamurthy2, Juhi Ansari3
1NSrinivas. D, Prof and Head mechanical engg, Research Scholar,JAIN, Bengaluru.
2S. Ramamurthy, Prof at R&D,CMET,JAIN, Bengaluru.
3Juhi Ansari, Asst prof, E&C, KCT Engg college, kalaburagi Research scholar VTU, Belagavi, Karnataka.
Manuscript received on November 11, 2019. | Revised Manuscript received on November 20 2019. | Manuscript published on 30 November, 2019. | PP: 11172-11176 | Volume-8 Issue-4, November 2019. | Retrieval Number: D7925118419/2019©BEIESP | DOI: 10.35940/ijrte.D7925.118419
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: A heat sink device is used with specific power input at 100V and 20W by the heater attached at the base plate of copper and then obtaining the average temperature of Heat sink by the help of 10 thermocouples .Two specimens of heat sinks were designed and were tested for mass flow rate and heat transfer coefficient. With base of 1.5mm&2.5mmtip thickness and another specimen with dimensions as tip0.5mm and1.00mmbase thickness are used By experimenting and CFD simulations,optimization of heat sink design was done.Then correlation and Validation foe both the specimen was done and were found satisfactory results.
Keywords: Base plate, Cooling fan, CFD Simulation, Heat sink, Heat Dissipation, IC’s ,Fin Configuration, Thermocouples.
Scope of the Article: Digital Clone or Simulation.