Boiling Curve and Droplet Evaporation Lifetime on Hot Hemispherical Copper Surface
Nor Atika ROSMAN1, Suhaimi ILLIAS2, Suhaila HUSSAIN3, Mohamad Shaiful Ashrul ISHAK4, Mohd Nazri OMAR5
1Nor Atika ROSMAN* School of Manufacturing Engineering, Universiti Malaysia Perlis, Pauh Putra Campus, Arau, Perlis, Malaysia.
2Suhaimi ILLIAS, School of Manufacturing Engineering, Universiti Malaysia Perlis, Pauh Putra Campus, Arau, Perlis, Malaysia.
3Suhaila HUSSAIN, School of Manufacturing Engineering, Universiti Malaysia Perlis, Pauh Putra Campus, Arau, Perlis, Malaysia.
4Mohamad Shaiful Ashrul ISHAK, School of Manufacturing Engineering, Universiti Malaysia Perlis, Pauh Putra Campus, Arau, Perlis, Malaysia.
5Mohd Nazri OMAR, School of Manufacturing Engineering, Universiti Malaysia Perlis, Pauh Putra Campus, Arau, Perlis, Malaysia.
Manuscript received on November 12, 2019. | Revised Manuscript received on November 23, 2019. | Manuscript published on 30 November, 2019. | PP: 8589-8592 | Volume-8 Issue-4, November 2019. | Retrieval Number: D7189118419/2019©BEIESP | DOI: 10.35940/ijrte.D7189.118419
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: The objective of this paper is to investigate the droplet evaporation lifetime and boiling curve on hot copper surface using ethanol liquid. We focus our study to find the Critical Heat Flux (CHF) and Leidenfrost temperature in the boiling curve. Copper material which has a high thermal conductivity, k was chosen as a test material. The copper material dimension was approximately 28.0 mm in height and 50.0 mm in diameter. The copper surface was modified into hemispherical surface in order to maximize the evaporation lifetime. The hemispherical surface was constructed using Electrical Discharge Machining (EDM). After completing the EDM process, the dimension of the hemispherical surface area was approximately 15.0 mm in depth and 30.0 mm in diameter. Meanwhile, ethanol liquid which has a low boiling point of 78 °C was chosen as a test fluid. The droplet diameter was approximately 3.628 mm. The impact height was set to be around 4.0 mm corresponding to drop impact velocity of 0.886 m/s. As a result, it was found that the critical heat flux (CHF) and Leidenfrost temperature range on hemispherical copper surface was approximately TCHF = 100.4-117.7 °C and TL = 170.0-175.8 °C, respectively. Keywords :
Keywords: Droplet, Evaporation Lifetime, CHF, Leidenfrost Temperature, Hemispherical Surface.
Scope of the Article: Frequency Selective Surface.