Heat Transfer Enhancement from Microprocessor
M. Sivasubramnanian1, K. D. Jaganathan2
1M. Sivasubramanian, Department of Automobile Engineering Mechanical Engineering, Kalasalingam Academy of Research and Education College, Krishnankoil (Tamil Nadu), India.
2K. D. Jaganathan, Assistant Professor, Department of Mechanical Engineering, SACS MAVMM Engineering College, Madurai (Tamil Nadu), India.
Manuscript received on 12 January 2020 | Revised Manuscript received on 29 January 2020 | Manuscript Published on 04 February 2020 | PP: 174-178 | Volume-8 Issue-4S4 December 2019 | Retrieval Number: D10551284S419/2019©BEIESP | DOI: 10.35940/ijrte.D1055.1284S419
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: Experiments were conducted to investigate the cooling of processor to increase the thermal performance by employing a mini channel instead of conventional heat sinks. Now a day’s aluminium fin with fans is used for cooling the processor. Constant speed of the fans is found to be not enough to remove the heat generated by the processor. The experimental investigations were carried out in the channels with the hydraulic diameter of about 1.5×10-3m for the Reynolds number varying from 80 to 1150. The water is allowed to pass through the channel by virtue of which heat is rejected from the processor. The influence of Reynolds number on heat transfer enhancement from the microprocessor is discussed in details. Comparison between heat transfer by air and by water is presented. From the experiment it is disclosed that further increase in heat transfer was observed when compared to air.
Keywords: Mini Channel, Liquid Cooling, Electronic Cooling, Reynolds Number.
Scope of the Article: Heat Transfer