MHD and Thermal Radiation Effects of a Nanofluid over a Stretching Sheet using HAM
Venkata Krishnarao B1, Jayaramireddy Konda2, Charankumar G3
1Venkatakrishna Rao B, Research scholar, Department of Mathematics, Rayalaseema University, kurnool, India.
2*Jayaramireddy Konda, Department of Mathematics, Koneru Lakshmaiah Education Foundation, Vaddeswaram, AP, India.
3Charankumar Ganteda, Department of Mathematics, Koneru Lakshmaiah Education Foundation, Vaddeswaram, AP, India.
Manuscript received on November 20, 2019. | Revised Manuscript received on November 26, 2019. | Manuscript published on 30 November, 2019. | PP: 3489-3496 | Volume-8 Issue-4, November 2019. | Retrieval Number: C6726098319/2019©BEIESP | DOI: 10.35940/ijrte.C6726.118419
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: In the present paper, we made an attempt to identify the governing conditions of heat and flow of a nanofluid over a flat plate using Homotopy analysis method (HAM). The arrangement of coupled nonlinear differential (CND) conditions is obtained from the partial differential conditions which will be determined by the homotopy analysis method (HAM). These methods will be useful to draw the conclusion based on the numerical and Graphical results of various parameters such as speed (velocity), concentration and temperature for different values of developing parameters shown in figures. Variations of skin-friction coefficient, Sherwood number and local Nusselt number have shown alongside. Finally conclusions have been drawn based on both diagrams and numerical results, it indicates that the non-linear partial differential equations are changed into a system of CN ODE’s and solved mathematically by using HAM method with shooting technique.
Keywords: MHD; Thermophoresis Parameter; Brownian Motion Parameter; Transpiration Parameter; Thermal Radiation; Heat Source; HAM.
Scope of the Article: Thermal Engineering.