Through Hole Component Inspection Monitoring System
Deepa P1, Anitha D B2, Mahesh Rao3
1Deepa P, Department of Engineering, and Communication Engineering, VVIET, Mysore, India.
2Anitha D B, Department of Engineering, and Communication Engineering, VVIET, Mysore, India.
3Dr. Mahesh Rao, Department of Engineering, and Communication Engineering, MIT, Mysore, India.
Manuscript received on 12 March 2019 | Revised Manuscript received on 17 March 2019 | Manuscript published on 30 July 2019 | PP: 4159-4164 | Volume-8 Issue-2, July 2019 | Retrieval Number: B3190078219/19©BEIESP | DOI: 10.35940/ijrte.B3190.078219
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© The Authors. Blue Eyes Intelligence Engineering and Sciences Publication (BEIESP). This is an open access article under the CC-BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/)
Abstract: For PCBA with through hole components, there is no easy, automated way of inspection like using AOI and AXI as employed for the Surface Mount Technology (SMT) components. As there is no such specific efficient inspection tool, till date manual inspection is the only solution for identifying defects in the Through Hole technology. Thus proposed work is defined to inspect few of the through hole component defects in an automated approach. Even though AXI is capable of detecting the Through Hole defects, it is rarely implemented due to its inaccurate results and cost. This results in increased cycle time, moderate efficiency, expensive and is very difficult to be focused for the operator on such repetitive task and that in turn affects the productivity and yield. As not much of research work has been carried out to find solution, a simple image processing technique has been tried here. In the proposed system a pattern matching technique is used for inspecting the defects like presence and absence of the Through Hole components in assembled PCB. In this work few different PCB images of same product have taken for inspection, further the inspection result is generated using LabVIEW Software.
Index Terms: Assembled Printed Circuit Board (PCBA), Through-Hole Technology (THT), Surface Mount Technology (SMT), Automated X-Ray Imaging (AXI), Pattern Matching.
Scope of the Article: Component-Based Software Engineering